Technology Capability
Fine Line/Pitch/Hole
Fine line : 2/2mil
Drilling pitch : 19.6mil
via Hole : 6mil (mechanical)
Advance Via Hole:4mil
High layer counts
Min : single layer
Max : 34 layers
Construction
Non-regular shapes and constructions
Panel size
Max 24”x 40”
Finished board thickness
Min : 4mil (0.1mm)
Max : 126mil (3.2mm)
Thin core
Min : 2mil
Copper thickness
Min : 1/4oz
Max : 16oz (outer layer)
Impedance
+/- 7%
Aspect ratio
1:20 (through hole)
Material
FR4, FR5, FCCL, (Rogers, Ventec, Nelco, Arlon, Polyimide...) further material request can be done per customer requirement
Manufacturing Capabilities
High Mix Lower Volume
Total amount 200,000 square feet per month
Inner and Outer Layer Capacity
Total amount 1,200,000 square feet per month